| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip fixed resistor surely enabling the soldering of end electrode films at both ends of a substrate even when the resistor is mounted upside down on the substrate. SOLUTION: Main electrode films 31, 33 are formed near both ends of the surface of a rectangular insulating substrate 21 respectively, and a resistance film 41 connecting a section between both main electrode films 31, 33 is formed while being superposed on parts of both main electrode films 31, 33 at the center of the surface of the insulating substrate 21. A resistance protective film 51 consisting of an insulating film is shaped on part of the surfaces of both main electrode films 31, 33 and the whole surface of the resistance film 41 so as to cover these surfaces. End electrode films 61, 63 are formed to sections extending over the upper and lower surfaces of both edge sections of the insulating substrate 21 through both edge sections so as to be connected to exposed surfaces 32, 34 from the resistance protective film 51 of both main electrode films 31, 33 respectively. Four projecting sections 53, 55 projected towards both end directions of the insulating substrate 21 are formed at the four comers of the resistance protective film 51. Both end electrode films 61, 63 are shaped up to places reaching the top faces of the four projecting sections 53, 55.</p> |
