发明名称 SEMICONDUCTIVE LAYER TREATMENT METHOD FOR POWER CABLE CONNECTION
摘要 <p>PROBLEM TO BE SOLVED: To improve reliability for connections and to make the forming work easier for the connections of a semiconductive layer between a cone-shaped member and a semiconductive layer of a cable when forming prefabricated connections or stress cone members on the cable. SOLUTION: At prefabricated connections of a cable constituting a high voltage power transmission line, a premold insulator to be combined with an insulation compact is constituted by combining a rubber cone member 21 and a semi-conductive body 22 in one united body, a projected member 23 is provided at the semiconductive body 22, a tapered surface portion 25 is formed on the projected member 23 and is fixed to the cable. The semiconductive layer 4 of the cable is separated at a predetermined interval from the cone-shaped member, both members are connected through the semiconductive layer 28, and a surface protective layer 29 is formed on the surface. When forming a semiconductive layer by winding a semiconductive tape, no air gaps should be created between the projected member of the semiconductive body and the semiconductive layer.</p>
申请公布号 JPH0937429(A) 申请公布日期 1997.02.07
申请号 JP19950207419 申请日期 1995.07.21
申请人 MITSUBISHI CABLE IND LTD 发明人 UEDA TOMOKIYO;HAYASHI KATSUYUKI
分类号 H02G15/08;H02G1/14;(IPC1-7):H02G1/14 主分类号 H02G15/08
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