发明名称 PRINTED-WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To prevent electric contact parts from being corroded, to prevent a solder from adhering to insertion holes and at the same time, to improve the mounting work for mounting components by a method wherein a carbon layer is formed on the electric contact parts. SOLUTION: A printed-wiring board 1 is a flexible printed circuit which is constituted using a board 2, which consists of a polyester material having a flexibility, as its base. Wiring parts 3 consisting of a copper foil, for example, are formed on the rear of this board 2. Electric contact parts 6 having an insertion hole 5 in the centers are provided for connecting lead wire terminals and a warning valve 10 with the wiring parts 3. In the case where the board 1 is used after being subjected to solder dip processing for connecting the lead wire terminals of other mounted components with the wiring parts 3 through the holes 5 and the parts 6, if a solder is adhered to the holes 5, a hindrance results in being constituted to the following process. Owing to that, a carbon layer 7 is formed on the surfaces of the parts 6.
申请公布号 JPH0936524(A) 申请公布日期 1997.02.07
申请号 JP19950184291 申请日期 1995.07.20
申请人 YAZAKI CORP 发明人 OHATA KUNIHIRO
分类号 H01R4/02;H05K1/18;H05K3/28;H05K3/34;H05K3/40;(IPC1-7):H05K3/28 主分类号 H01R4/02
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