| 摘要 |
<p>A tester (40) for testing integrated circuits-containing semiconductor wafers or substrates (84), includes a vertically oriented performance board (42) with D/A converters (43) mounted and pin (38) connected immediately therebehind. A prober (10) including a vertical array of connector pins (12) mounts a vertical probe card (50) and a vertically-mounted chuck (32) on which a vertically oriented wafer or substrate (84) is held. One of the tester (40) and prober (10) are moved with respect to the other to dock and latch the tester (40) and prober (10) together. Simultaneously, the array of connector pins (22) is electrically connected to electrical connectors on the performance board (42) and probe needles (51) extending from a probe card (50) are placed into test contact with contact pads on the integrated circuits on the wafer or substrate (84).</p> |
