发明名称 |
Papierschutzmaterial zum Abpacken von elektronischen Erzeugnissen |
摘要 |
A paper buffering material for pre-packing an electronic product which can replace the conventional foamed polystyrene resin. The buffering material includes a paper panel of predetermined width and shape, which has a plurality of grooves in predetermined portions thereof to fix and support the electronic product and a plurality of ribs on both surfaces of the panel to buffer external impacts. |
申请公布号 |
DE19628660(A1) |
申请公布日期 |
1997.02.06 |
申请号 |
DE1996128660 |
申请日期 |
1996.07.16 |
申请人 |
LG ELECTRONICS INC., SEOUL/SOUL, KR |
发明人 |
SON, YOUNG HO, KUMI, KR |
分类号 |
B65D81/05;B65D81/127;B65D81/133;B65D85/30 |
主分类号 |
B65D81/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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