发明名称 Papierschutzmaterial zum Abpacken von elektronischen Erzeugnissen
摘要 A paper buffering material for pre-packing an electronic product which can replace the conventional foamed polystyrene resin. The buffering material includes a paper panel of predetermined width and shape, which has a plurality of grooves in predetermined portions thereof to fix and support the electronic product and a plurality of ribs on both surfaces of the panel to buffer external impacts.
申请公布号 DE19628660(A1) 申请公布日期 1997.02.06
申请号 DE1996128660 申请日期 1996.07.16
申请人 LG ELECTRONICS INC., SEOUL/SOUL, KR 发明人 SON, YOUNG HO, KUMI, KR
分类号 B65D81/05;B65D81/127;B65D81/133;B65D85/30 主分类号 B65D81/05
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