Type TO-220 semiconductor package for integrated circuit - has support, binding wiring and conductor encapsulation such that conductors have same thickness as support, support and conductors formed as single item from metal sheet

摘要

The package includes an IC-chip (30) provided with a matrix of binding pads. Also provided are several conductors (20) which are connected to corresponding binding pads via binding wiring, and an IC-holding support (235). The support, the binding wiring and sections of the conductor encapsulation are such that the conductors have the same thickness as the support. The support and the conductors are formed as a single item from a sheet of electrically conductive material.