发明名称 Photodiode und Verfahren zu deren Herstellung
摘要 An active region (6) in an SOI substrate is completely surrounded by a pit (4) filled with insulating material. A first doped region (8) contiguous to the pit is formed in particular by diffusion out of a doped layer on the wall of the pit (4). The first doped region (8) and a second doped region (12) form a pn-junction of a photodiode.
申请公布号 DE19528573(A1) 申请公布日期 1997.02.06
申请号 DE19951028573 申请日期 1995.08.03
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 OPPERMANN, KLAUS-GUENTER, DIPL.-PHYS., 83607 HOLZKIRCHEN, DE
分类号 H01L31/10;H01L21/762;H01L31/0352;H01L31/103;(IPC1-7):H01L31/101;H01L21/86;H01L21/306 主分类号 H01L31/10
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