| 摘要 |
A process for manufacturing a chip type tantalum solid electrolytic condenser having good dampproof feature is disclosed. In the process, after a tantalum element(1) is manufactured by a formation, a sintering, a transformation, burning, a carbonizing, and a silver coating, the tantalum element is weld by (+) frame(2) and (-) lead frame(3). An outer periphery of weld tantalum element(1) is firstly under-coated by a silicon resin(7) and then is hardened at 120degree C for one hour to two hours. The firstly under-coated element is secondly under-coated by an acryloyl resin (8) and then is hardened at 120degree C for one hour to two hours. The outside of the firstly and secondly under-coated element is formed by means of an epoxy mold resin(6).
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