Assembly of an infrared detector with thermal compensation

摘要

The method involves bringing together an electronic detection circuit (8), comprising photodiodes in rows or matrices connected to a readout circuit (7) by In microspheres (9), and a thermally conductive support (5) integrated into a cryostat (4). An intermediate thermally conductive element is constituted by a sapphire plate (11) covered with 10 mu m of metallic powder filled epoxy adhesive, and an AlN plate (14) bonded to it with a silicone adhesive film. The thickness of the intermediate element is a function of that of the readout circuit.