发明名称 |
Molded plastic semi-conductor package including an aluminum alloy heat spreader |
摘要 |
There is provided a molded plastic electronic package having improved thermal dissipation. A heat spreader, formed from aluminum or an aluminum alloy, is partially encapsulated in the molding resin. Forming a black anodization layer on the surface of the heat spreader improves both thermal dissipation and adhesion to the molding resin. |
申请公布号 |
PH30198(A) |
申请公布日期 |
1997.02.05 |
申请号 |
PH19940000467 |
申请日期 |
1993.09.01 |
申请人 |
OLIN CORPORATION |
发明人 |
MAHULIKAR DEEPAK;CHEN, SZUCHAIN, F.;BRADEN, JEFFREY, S. |
分类号 |
H01L23/28;H01L23/31;H01L23/373;H01L23/433 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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