发明名称 |
Semiconductor device comprising a semiconductor substrate, an element formed thereon, and a stress-buffering film made of a silicone ladder resin |
摘要 |
A semiconductor device having a stress-buffering film which is effective in buffering the stress caused by a molding resin during sealing, the stress-buffering film being made of a silicone ladder resin represented by formula (I) <IMAGE> (I) wherein each end group R may be the same or different and represents a hydrogen atom or an alkyl group, each side chain R' may be the same or different and represents a cyclohexyl group, a lower alkyl group, or a photopolymerizable unsaturated group, and n is an integer of 10 or larger.
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申请公布号 |
US5600151(A) |
申请公布日期 |
1997.02.04 |
申请号 |
US19950387168 |
申请日期 |
1995.02.13 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
ADACHI, ETSUSHI;ADACHI, HISOSHI;YAMAMOTO, SHIGEYUKI;NISHIMURA, HIROYUKI;MINAMI, SHINTARO;TAZIMA, TOORU;TOBIMATSU, HIROSHI |
分类号 |
H01L21/312;H01L23/29;(IPC1-7):H01L23/28;H01L21/02 |
主分类号 |
H01L21/312 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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