| 摘要 |
For packaging a semiconductor device, a metal plate is formed to include a central plate portion and a peripheral plate portion extending outwardly from the central plate portion. The central plate portion has a first surface for mounting the semiconductor device and has a second surface opposite to the first surface in a predetermined direction. The peripheral plate portion is bent to face the second surface of the central plate portion and extends substantially along a reference plane which is perpendicular to the predetermined direction. The peripheral plate portion has a particular portion projecting from the reference plane opposite the central plate portion. An insulator layer is deposited on the metal plate. In addition, a conductive pattern is formed on the insulator layer. The insulator layer extends along the metal plate from the first surface of the central plate portion to the peripheral plate portion to cover the particular portion. The conductive pattern extends along the insulator layer from the central plate portion to the particular portion.
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