| 摘要 |
A two-dimensional optoelectronic array module contains metal, semiconductor metal, or P-I-N photodetectors which detect light, and converts it to electrical signals provided to conventional integrated circuitry contained on the same wafer. The circuitry processes the electrical signals, and drives an array of vertical cavity lasers on another wafer through solder bumps which carry driver signals and connect the two wafers together. The detectors are thin membranes formed by etching intrinsic silicon wafers, and have anti-reflective coatings and Schottky metal contacts. The module is cooled via microchannels.
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