| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate the drop of water from a cutting water supply nozzle at the time of setting up by forming a drain communicating unit at the predetermined position of a supply pipe, and draining the cutting water between a cutting water supply nozzle and the communicating unit via a drain pipe at the time of setting up. SOLUTION: At the time of cutting a wafer W held on a chuck table T, cutting water is fed from a water source 14 to a supply pipe 9, and the wafer W is cut by a blade 1 while injecting the wafer from a cutting water supply nozzle 3. After cutting, when a switching valve 10 is switched, the supply of the water to the pipe 9 is stopped, the pipe 9 communicates with a drain pipe 11, i.e., a drain communicating unit 12 is formed, the residual cutting water between the nozzle 3 and the unit 12 is drain from the pipe 11 in a drain receiver 13 by the residual pressure in the pipe 9 and the principle of siphon. Accordingly, the water is not stored in the nozzle 3, and hence the water is not dropped at the time of setting up.</p> |
