| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum chuck device which is not influenced by uneveness or a recessed groove on a vacuum suction plate. SOLUTION: A sheet 7 having an adhesive layer 7a on its one surface is stuck onto the top surface of a substrate 3 (thin piece) to be polished and the substrate 3 is attracted by a vacuum sucker plate 2b through the sheet 7. Accordingly, polishing not being influenced by uneveness or recessed groove on the lower surface of the plate 2b is made possible, resulting in a smooth and flat surface of the polished substrate 3. |
