| 摘要 |
A electronic chip removal and replacement system to be used to remove and replace a surface mounted or edge connected electronic chip from a circuit board, the system including a heater assembly having a heater unit which produces a quantity of heat, thereby heating an air flow which passes thereover to produce heated air which exits the heater assembly through an outlet nozzle. The hot air flow is applied to the electronic chip in a specific controlled pattern as directed through a microprocessor which directs a timed and ramped increase and decrease of a temperature of the heater unit in accordance with a specific type of chip being heated. Further, the microprocessor is structured such that it can be disengaged remotely whereby only the heater unit is shut down and not the remainder of the system including the air flow over the heater unit, thereby allowing the heater unit to cool down between uses and facilitating ramped up heating in accordance with a specific ramped heating profile corresponding the specific type of electronic chip being replaced or removed.
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