发明名称 Temperature clamping method for anti-contamination and collimating devices for thin film processes
摘要 In a thin film process system, an anti-contamination device, anti-flake shield or collimator plate, is fit to a process chamber. By maintaining a temperature differential between the chamber body and the device, or between the device and any adapter used to conform the device to the chamber apparatus, the device expands to maintain a substantially sealing press fit to the chamber body. The temperature differential can be maintained even when the process is finished until it is time to remove the device for cleaning or disposal and replacement.
申请公布号 US5598622(A) 申请公布日期 1997.02.04
申请号 US19950384187 申请日期 1995.02.06
申请人 APPLIED MATERIALS, INC. 发明人 RAAIJMAKERS, IVO J.
分类号 B23P11/02;C23C14/54;C23C14/56;H01J37/32;(IPC1-7):B23P11/02 主分类号 B23P11/02
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