| 摘要 |
<p>PROBLEM TO BE SOLVED: To connect each of electrodes of sensor tips to member to be a lead wire for each of electrodes without using a bonding wire. SOLUTION: A band like connecting member 12 to be a lead wire is formed forming plural conducting foils 17 on a filmy substrate 16 and a lead terminal 19 is formed at the end of the each conducting foils 17. Each of the lead terminals 19 and each of bonding pads 15 to be electrode of the sensor tips 13 are connected using for example a bump. Thereby each of the bonding pads 15 can be connected to lead terminal 19 without using any bonding wire, therefore the height of the connected portion can be suppressed and the sensor tip 13 can be readily assembled into a catheter.</p> |
