发明名称 Verpackung für ein elektronisches Bauelement
摘要 A package for electronic components (10), in particular a strip-shaped package, has a closable depression (2) into which the electronic components may be placed so that their connections (11) lie free. One side wall (6) of the depression (3) is shaped to form a shock-absorbing spring element, for example by sinuously folding the side wall. The base (9) of the side wall (6) is lower than the bottom (5) of the depression (3). In the disclosed package, all side walls of the depressions are shaped to be shock-absorbing.
申请公布号 DE19527021(A1) 申请公布日期 1997.01.30
申请号 DE19951027021 申请日期 1995.07.24
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 WILDE, RUEDIGER, 81476 MUENCHEN, DE
分类号 B65D73/02;B65D85/86;H05K13/02;H05K13/04;(IPC1-7):B65D85/86;B65D75/34;B65D75/42 主分类号 B65D73/02
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