Halbleiteranordnung

摘要

To solve the problem that very little heat is dissipated from the surface, the capacity is restricted, and the inductance is high when electrodes on the surface of many semiconductor elements contained in one container with the terminal conductors are connected by wire bonding, the invention provides a semiconductor device (1) wherein a current flowing and heat-dissipating path is formed by contacting bodies (2,5) that make contact with the electrodes (11,12) on the surface of the semiconductor elements and the spring via a spring (6) that makes contact with the inner face of the terminal body (7), which has one face exposed to the outside, or a heat dissipating path is formed by contacting bodies, the pressurising body being coupled with the contacting body via the electrically conductive plate, and the spring, and a current flowing path is formed by connecting an electrically conductive plate with the terminal body. This construction allows the module to be cooled from both sides of the container, and allows the inductance to be reduced.