Sputtering target with highly adherent sputtering material - bonded to base plate by inexpensive metal powder-contg. epoxide adhesive

摘要

Sputtering target, esp. of large dimensions and of brittle material such as Si, Ge, In2O3 or SnO2, has a target base plate and an adhesive layer, pref. of metal powder-contg. epoxide resin adhesive, between the sputtering material and the base plate, the target material applied directly onto the base plate with interposition of the adhesive layer and the metal powder being Cu, Ni, Au or Fe. Also claimed is a method of producing the above target by (a) applying the target material directly onto the base plate with interposition of the adhesive layer; (b) heating the target for 1 hr. at 80[deg]C; and (c) curing at room temp.