发明名称 ELECTRONIC COMPONENT MOUNTING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain an electronic mounting device which is capable of mounting an electronic component at a high speed by a method wherein the device is set variable in intermittent feed drive rate corresponding to the type of electronic components. SOLUTION: An electronic component mounting device mounts on a board an electronic component which is vacuum-chucked by a nozzle from a component feeding section 1 which intermittently feeds electronic components, wherein a control section 14 which recognizes the intermittent feed rate of the component feeding section 1 corresponding to the type of electronic component and a component feed drive section which sets the feed lever 8 of the component feed section 1 variable in drive rate so as to intermittently feed electronic components as many as prescribed by the control section 14 are provided. The component feed drive section is formed of a link mechanism which is composed of a supporting point pin 12 capable of being changed in position by a switching motor 10, a link block 13, and a first and a second link, 18 and 19, and interposed between a drive lever 17 and a feed drive lever 12.
申请公布号 JPH0927696(A) 申请公布日期 1997.01.28
申请号 JP19950175796 申请日期 1995.07.12
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKURAI KUNIO;HIRAI WATARU;YAMAMOTO MINORU;MOGI SEIICHI
分类号 B23P21/00;H05K13/00;H05K13/02;H05K13/04 主分类号 B23P21/00
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