Method for forming a solder bump by solder-jetting or the like

摘要

The present invention provides a method for forming a solder bump (24) on a substrate (20). The substrate (20) includes a bond pad (18) having a faying surface (19) composed of solder-wettable metal. The method includes coating the faying surface (19) with a plate (16) formed of a first metal having a first melting temperature, and projecting a discrete microdroplet (14) onto the plate (16). The microdroplet (14) is formed of a molten second metal and has a second melting temperature greater than the first melting temperature. The microdroplet (14) fuses to the plate (16) to form the solder bump (24).