| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a package by which every electrode of a semiconductor integrated circuit element to be housed internally is electrically connected surely to a prescribed external electric circuit by a method wherein the other end side of every external lead terminal is attached to, and mounted on, an electric insulating coupling member and the coupling member is fixed to a container via a reinforcement member. SOLUTION: Every coupling member 8 which is composed of an electric insulating material is attached to, and mounted on, the other end side protruding to the outside from the side face of a container which comprises a space used to internally house a semiconductor element out of external lead terminals 7. The respective external lead terminals 7 maintain a prescribed interval between the respective adjacent external lead terminals 7 by every coupling member 8. Their large deformation due to the application of an external force can be prevented effectively. In addition, every coupling member 8 is fixed to an insulating base body via reinforcement members 9. The external lead terminals 7 do not come off from every metallized wiring layer 5. Every electrode of a semiconductor integrated circuit element housed in the interior of the container is electrically connected firmly to every prescribed lead terminal 7.</p> |
