| 摘要 |
PROBLEM TO BE SOLVED: To prevent the dimensional increase of a semiconductor element due to the increase of the number of each electrode for a signal line, a power supply line and a ground line by making wires connected to each electrode a different height to each other with respect to the upper surface of a semiconductor element and making a wire from an electrode for a signal line a middle in the height of wires from the other two electrodes. SOLUTION: Each electrode 2a to 2c and each internal lead 3a to 3c are respectively interconnected by a wire 4a for a power supply line, a wire 4b for a signal line and a wire 4c for a ground line. An internal lead 3a for a power supply, an internal lead 3b for a signal line and an internal lead 3c for a ground line are disposed in that order in nearly parallel to the peripheral edge of a semiconductor element on the outside of the semiconductor element. Also, the wires 4a to 4c are disposed so that the height positions are different to each other. That is, the wire 4b for a signal line is made a middle in height, the wire 4a for a power supply line is made to come to an upper position than the wire 4b for a signal line and the wire 4c for a ground line is made to come to a lower position than the wire 4b for a signal line. |
