ELECTRONIC ASSEMBLY WITH IMPROVED GROUNDING AND EMI SHIELDING

摘要

An electronic assembly (2) includes an electronic module (8) mountable to a backplane (4) having a ground plane (48) for grounding and EMI shielding. The module includes a conductive chassis (10) having a floating chassis board (12). Connector (18) is mounted to the chassis board and mates with connectors (20) mounted on the backplane when the module engages the backplane. Grounding clip (24) mounted to the chassis board engages an alignment pin (42) extending from the backplane and includes a laterally extending resilient arm (30) which grounds the clip to the chassis. The grounding clip is electrically connected to the chassis board ground plane (22) so that both ground planes are grounded to the chassis through the grounding clip. The backplane includes a ground pad (50) which circumscribes the connectors and is connected to the ground plane. Conductive gasket (54) mechanically and electrically couples the chassis with the ground pad.