| 摘要 |
<p>PROBLEM TO BE SOLVED: To manufacture a semiconductor device which is thin without increasing its manufacturing costs. SOLUTION: A semiconductor chip 1 is provided with a circuit formation face 4 on which bonding pads 5 have been formed and with a face 6, on which no circuit is formed, on the opposite side of the circuit formation face 4, and an insulating film 11 is formed integrally on the face 6 on which no circuit is formed. Leads 7 are provided with a plurality of inner lead parts 7a and outer lead parts 7b, and at least a part of the inner lead parts 7a is extended along the face 6 on which no circuit is formed. The inner lead parts 7a in a part extended along the face 6, on which no circuit is formed, and the face 6 on which no circuit is formed are bonded by an adhesive 12.</p> |
