| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which is provided with an external connecting terminal which is stable even under the temperature condition of repairs. SOLUTION: A semiconductor device 1 is provided with external connecting terminals 4 which are formed so as to protrude from the surface of a substrate 2, and it is mounted on a motherboard when the external connecting terminals 4 are soldered. In the semiconductor device, the external connecting terminals 4 are composed of a conductive paste whose melting point is higher than the melting point of solder used in their mounting operation.</p> |
