发明名称 Method and apparatus for inspecting solder portions
摘要 An image taking device serves to take an image of an object to be inspected, and outputs an image signal representative thereof. A first deciding device serves to decide a condition of the object in response to the image signal. A measuring device serves to measure a shape of the object, and outputs a height signal representative of a height of the object. A second deciding device serves to decide a condition of the object in response to the height signal. A control device serves to, in cases where the first deciding device can not detect the condition of the object, enable the measuring device to measure the shape of the object and enable the second deciding device to decide the condition of the object, and enable the first deciding device to execute a leaning process on the object in response to a result of the decision by the second deciding device.
申请公布号 US5598345(A) 申请公布日期 1997.01.28
申请号 US19940225944 申请日期 1994.04.11
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TOKURA, NOBUFUMI
分类号 G01N21/88;G01N21/956;G01R31/04;G01R31/309;H05K13/08;(IPC1-7):G06F17/50 主分类号 G01N21/88
代理机构 代理人
主权项
地址