PRODUCTION OF OPTICAL WAVEGUIDE MODULE

摘要

PROBLEM TO BE SOLVED: To make it possible to remove or decrease the stresses remaining in a cured adhesive of a UV curing type by irradiating the adhesive with UV rays to cure the adhesive, then heat treating the adhesive. SOLUTION: The adhesive 14 of the UV curing type is packed between the joining end face of an optical waveguide substrate 12 and the joining end faces of fiber arrays 11, 13. The adhesive 14 is cured by irradiating the packed adhesive 14 with the UV rays. The cured adhesive 14 is then heat treated at a temp. above 40 deg.C and below the glass transition temp. of the adhesive 14. The state in which the degree of curing of the adhesive 14 varis between the outside surface and inside surface of the adhesive 14 is resulted and the curing strains arise if the adhesive 14 of the UV curing type packed between the joining end faces is irradiated with the UV rays in such a manner. These curing strains are relieved with lapse of time by subjecting the cured adhesive 14 to the heat treatment at the temp. conditions described above or subjecting the adhesive to a heat cycle treatment.