| 摘要 |
<p>PROBLEM TO BE SOLVED: To make the resistance between terminals on a driving IC and a transparent substrate low and to improve the resistance to errosion of terminals on the substrate by making distance between bumps of a driving IC to be connected to terminals smaller than that between terminals to be connected to the bumps. SOLUTION: In the output terminals DTM from a drain driving IC, the distance L1 between bumps BUMP to be connected to terminals DTM is made smaller than the distance L2 between terminals DTM. For example, L1 is 20μm and L2 is 20μm. Consequently, since the width of the bump BUMP is wider than that of the terminal DTM, even through the mis-registration of the bumps BUMP is generated by the mis-registration of the drain driving IC, the contact areas between the bumps BUMP and the terminals DTM are maintained and the resistances are made low. Moreover, since the distance L2 between terminals DTM is made large, electric errosion of terminals DTM made of a transparent electrically conductive film d1 in which the electric errosion is apt to be generated is suppressed.</p> |
