| 摘要 |
PROBLEM TO BE SOLVED: To obtain a transfer method for conductive resin paste in which further equalized and easy transfer and generalization are possible. SOLUTION: Anisotropic conductive resin paste 2 is applied with a squeegee on porous transfer stage 1 constituted of a baked metal or an oil stone, and after that a bump 5a of a semiconductor chip 5 is contacted with and transferred to the stage. |
