| 摘要 |
PROBLEM TO BE SOLVED: To provide a brazing filler metal which smoothes a surface in spite of melting by heating and a package for housing a semiconductor element which obviates the occurrence of an appearance defect. SOLUTION: This brazing filler metal is formed of 50 to 95wt.% silver, 5 to 50wt.% copper, 1×10<-5> to 1wt.% phosphorus, 1×10<-5> to 1wt.% boron and 5×10<-6> to 1wt.% tellurium. This package for housing the semiconductor is formed by brazing and mounting external lead terminals 7 to prescribed metallized wiring layers 5 by using such brazing filler metal. |
