INTEGRATED CIRCUIT DEVICE AND INNER LEAD

摘要

PROBLEM TO BE SOLVED: To provide a miniaturized IC device with an inner lead having high connection strength and high mechanical strength and a method of forming the inner lead. SOLUTION: A device hole in which a film 11 and an IC chip 18 are disposed is formed, and copper foil applied to the surface of the film 11 on the device hole is etched to form an inner lead with a tip part 16c which is narrower than the width of a bump 19 formed in the surface of an IC chip 18 and a base part 16d which is wider than the width of the bump 19. At least the tip part 16c and the bump 19 of the IC chip are bonded, and it is punched at K of the base part 16d to separate the bonded IC chip 18 from the film 11.