SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To divide a semiconductor wafer into chips at high yield and low cost and facilitate the handling of the wafer during carrying. SOLUTION: A semiconductor device has a structure with an exposed low mechanical strength part comprises a semiconductor wafer 1 having a mechanically low strength structural part such as sensors la formed thereon and removable protective caps 2a formed on the wafer 1 to protect the structural part.