| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in humidity resistance, moldability and soldering-heat resistance by mixing a specified epoxy resin with a specified dicyclopentadiene/phenol polymer, a methyl methacrylate/ butadiene/styrene copolymer resin and a specified silicon nitride powder. SOLUTION: This epoxy resin composition consists essentially of an epoxy resin represented by formula I, a dicyclopentadiene/phenol polymer represented by formula II (wherein R<2> is Cm H2m+1 ; and (m) and (n) are each 0 or an integer of 1 or greater), a methyl methacrylate/butadiene/styrene copolymer resin and 25-90wt.%, based on the total resin composition, silicon nitride powder having an concentration of surface oxygen present in the SiO2 layer of 0.5-15% and a mean particle diameter of 10-50μm.
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