发明名称 INNER LEAD BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an inner lead bonding device which can press-fit an inner lead with high accuracy even when the inner lead is fined. SOLUTION: A driving mechanism for driving a clamp 4 for holding a carrier tape 3 in a bonding place in the directions of an X-axis, a Y-axis and aθ-axis is provided. A CCD camera 9 is hung on the up-stream side of a bonding tool 1, and the image of the position of the inner lead 5 of the carrier tape is picked up by the CCD camera 9 to input the image information to an image processing device 10. In the image processing device 10, the reference position information of the carrier tape 3 which is inputted in advance is compared with the position information of the carrier tape 3 which is inputted from the CCD camera 9 to perform computation and the difference is outputted to a controller 12A. The controller 12A drives the driving mechanism 11A to correct the stop position of the carrier tape 3 for a predetermined position through the clamp 4.
申请公布号 JPH0927520(A) 申请公布日期 1997.01.28
申请号 JP19950173205 申请日期 1995.07.10
申请人 TOSHIBA CORP 发明人 SUETAKE ISAO
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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