Integrated circuit device, e.g. chip scale package

摘要

The device includes an integrated circuit chip (102) with several input/output connections (104) on a main surface (108). An anisotropic electrically conductive layer (106) is deposited on this main chip surface, the layer being conductive in the same angle of intersection as that possessed by the surface layer and being non-conductive in other directions. The anisotropic layer is provided between a dielectric substrate (122) and the IC chip. Provided on the dielectric substrate are several electrical pads (110) which are arranged with the anisotropic layer. These pads are connected to the input/output connections in one direction while being insulated from them in another.