Verfahren zum Montieren von Chip-Bauteilen und Gerät dafür

摘要

The present invention relates to a method and apparatus for mounting chip components adapted to recognize and remove errors in disposing and aligning a plurality of attracting nozzles at the mounting head of the apparatus. Specifically, the nozzles are checked by means of detecting external shape elements thereof in view of a correct positioning and selection of a certain attracting nozzle with respect to a certain chip component to be mounted among said plurality of said nozzles.