| 摘要 |
<p>The present invention provides a process for assembling electronics which allows for rapid heating and fast curing, and avoids subjecting the components to potentially damaging cure conditions. The process includes applying conductive or non-conductive curable thermoplastic or thermosetting resins, having adhesive properties, to a surface of the substrate or electrical component or both. One or more electrical components may be mounted on the substrate using the adhesive properties of the resin. The resin is then subjected to variable frequency microwave irradiation selected to cure the resin without adversely affecting the substrate or electrical components.</p> |
