| 摘要 |
An electronic package (10) having improved thermal performance. In the case of a plastic (30) package, the inner ends (20) of the leads (18) of the lead frame are attached to a heat slug (12) by a high thermal conductivity material (32) such as solder or a polymeric material. In the case of a metal package, the inner ends of the leads of the lead frame are attached to the metal base component by a high thermal conductivity material. |
