Verfahren zum Anordnen eines Halbleiterkörpers auf einem Träger

摘要

The invention relates to a method of providing a semiconductor body (3) on a support (1) with the interposition of a metal layer of aluminium (2). The adherence is effected in that the semiconductor body and the support are pressed against each other during the supply of heat at the area of the metal layer. The metal layer of aluminium is first applied to the support by flame spraying.