Electronic device packaging assembly

摘要

An electronic device package assembly including a base member; a cover member; a lead frame having a plurality of leads disposed between the base member and the cover member; an electronic device disposed between the base member and the cover member and electrically attached to the leads; bonding rings for bonding the base member and the cover member to the lead frame; and spacers disposed between the lead frame and the base member and the lead frame and the cover member for maintaining the base member and the cover member at a predetermined spacing from the lead frame.