| 摘要 |
PURPOSE:To apply wax more uniformly and more thinly by pushing the underside of a wafer against the opening section of a wax storage section through a moving means in a sucking section sucking and holding the wafer, attaching wax and dispersing wax by centrifugal force. CONSTITUTION:Wax Wx corresponding to one wafer W flows into a storage section 6 through a filter 20 from a communicating path 7 by the upward stroke of a main actuator 11, and is brought to the state in which wax is projected by surface tension from the upper edge of a ring 17 for the storage section 6. A sucking section 23 closely contacts a surface to be polished in the wafer W with the underside of a disk member 24 and sucks the surface to be polished, and a vertical arm 25 is inverted and the wafer W is held. A sub-actuator 12 is operated in the direction of elevation, a cylindrical body 1 is lifted, and a wax Wx surface layer in the storage section 6 is pushed against the underside of the wafer W. The sub-actuator 12 is lowered, and wax Wx is spread onto the whole surface of the wafer W by centrifugal force by the revolution of the disk member 24, and applied uniformly. |
