Semiconductor probe card device with a ball-bump

摘要

The present invention provides a semiconductor device comprising at least one ball-bump, characterized by a semiconductor substrate (1) formed with at least one recessed portion (16), and an electrically conductive layer (4) covering at least a surface of the recessed portion (16) therewith the ball-bump (5) being formed on the electrically conductive layer (4) within the recessed portion (16). The semiconductor device can act as a probe card by additionally having a tester device (2) formed in the semiconductor substrate (1) and provided with a function of testing electrical performances of a semiconductor device. Since the recessed portion (16) can be formed by lithography technique, it is possible to locate the ball-bumps (5) in place with higher accuracy than a conventional semiconductor device.