| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which the warpage of a component holder caused in each process can be eliminated and the outer electrodes of an electronic component can be formed satisfactorily. SOLUTION: When chip components C are pushed into the holding holes 3a of a component holder 1 and when the chip components C are moved in the holding holes 3a, the frame parts 2a and supported part 2e of the component holder 1 are respectively supported to receive forces necessary for the above mentioned processes. With this constitution, even if a force in a component pushing direction and a force in a component transfer direction are applied to the component holder 1 through the chip components C, the component holder 1 is not warped. |
