APPARATUS FOR FORMING OUTER ELECTRODE OF ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide an apparatus for forming the outer electrode of an electronic component which can prevent the fall-off of a chip component which happens when the chip component is separated from a pasted surface. SOLUTION: Fine unevenness is formed on the upper surface (pasted surface) of a pasting table 1 by the through holes 1c of a mesh plate 1b to reduce the contact area between the end surface of a chip component C and the pasted surface. With this constitution, a tensile force which is produced when the end surface of the chip component C is separated from the pasted surface is reduced and the fall-off of the chip component from a component holding plate can be avoided.