发明名称 METHOD OF FORMING OUTER ELECTRODE OF ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To avoid the inclinations of chip electronic components and form outer electrodes satisfactorily by a method wherein, when the chip components are pushed into the holding holes of a component holder, a pushing speed in an initial stage is smaller than a pushing speed afterwards. SOLUTION: In order to push chip components into the holding holes 3a of the elastic unit 3 of a component holder 1, a guide plate is transferred to a position above the component holder and a motor shaft 31 is turned 360 deg.. The chip component which is held by the temporary holding hole of the guide plate is pushed into the holding hole 3a by a pushing pin 21 descending from the above. At that time, in accordance with the shape of a driving cam 32, the pushing speed is gradually increased since the start of pushing till the finish of pushing as shown in (b) and the speed in an initial stage is substantially smaller than the speed afterwards. Even if there is a discrepancy between the center axis of the chip component and the center axis of the holding hole 3a, a counter force which is applied to the chip component when it touches the elastic unit 3 is suppressed to be very low to avoid the inclination of the chip component.</p>
申请公布号 JPH0922853(A) 申请公布日期 1997.01.21
申请号 JP19950171938 申请日期 1995.07.07
申请人 TAIYO YUDEN CO LTD 发明人 IWAO HIDEMI;NAGANUMA KAZUO
分类号 H01C17/00;H01C17/28;H01G13/00 主分类号 H01C17/00
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