发明名称 CHIP PART SUPPLYING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide an external electrode forming method of chip part for eliminating the need for such protruding member as a pin when shifting a chip part element body from a chip part supplying device to a carrier plate and for uniformly shifting the chip part element body to the carrier plate. SOLUTION: When shifting a chip part element body 3 housed in a storage space 1e of a chip part supplying device 1 to a retention space 2c of a carrier plate 2, a housing space 1e of the chip part supplying device 1 and a retention space 2c of the carrier plate 2 are arranged opposingly and either the chip part supplying device 1 or the carrier plate 2 is moved toward the other, thus shrinking a stretching plate part 1a, gradually moving the chip part element body 3 toward the retention space 2c against the elastic force of the carrier plate 2, and housing the element body 3 in the retention space 2c.</p>
申请公布号 JPH0922805(A) 申请公布日期 1997.01.21
申请号 JP19950172025 申请日期 1995.07.07
申请人 TAIYO YUDEN CO LTD 发明人 INAI MASAYUKI;TSUKADA MASABUMI;OKAMOTO MASAKI;DOI KENJI;NAKAMURA TOSHIYA;URANO TETSUYA;MATSUI HIROYUKI
分类号 H01C17/00;H01C17/28;H01G4/012;H01G13/00 主分类号 H01C17/00
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