MANUFACTURE OF PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed circuit board which can increase adhesion strength of an interlayer insulating film and an upper layer conductor circuit as compared with the prior art case. SOLUTION: A manufacturing method of a printed circuit board consists of the following; a process wherein a photosensitive resin layer for obtaining an interlayer insulating film is formed on a substratum 11 on which a lower layer conductor circuit 13 is formed, a process wherein the resin layer is cured, a final exposure process for reacting unreacted photosensitive group left in the resin layer after curing, and a process wherein the surface of the resin layer after curing is roughened for improving adhesion strength of the resin layer after curing and a metal film for forming an upper layer conductor circuit to be formed later on the resin layer. A process wherein the surface of the resin layer is roughened is performed before the final exposure process.